Optoelectronic modules having fluid permeable channels and methods for manufacturing the same

ABSTRACT

An optoelectronic module includes a spacer with an optical component mounting surface, a fluid permeable channel, and a module mounting surface. The fluid permeable channel and module mounting surface allow the channels to be sealed to foreign matter during certain manufacturing steps and to remain free from blockages, such as solidified flux, during certain manufacturing steps. Further, the channels can permit heat to escape from the optoelectronic module during operation.

BACKGROUND

A typical optoelectronic module is often constructed with at least onefluid permeable channel, such as a venting hole, designed to allowfluids, such as gasses, to pass into or out of a cavity within themodule. Fluid permeable channels can be incorporated into a module for anumber of reasons. For example, a module that includes a heat-generatingactive optoelectronic component (e.g., a laser diode or a light-emittingdiode) mounted onto an electrical substrate within a cavity may requirea fluid-permeable channel for optimum performance That is, duringoperation, heat generated by the component can accumulate within themodule and can alter the performance of temperature-sensitive electroniccomponents or alter the size or shape of dimension-critical components,such as optical elements (e.g., refractive, diffractive lenses) orspacers between optical elements. A fluid-permeable channel through theelectronic substrate and adjacent to the heat-generating component,however, can conduct heat out of the cavity and away from any adjacenttemperature-sensitive electronic components, optical elements, orspacers.

The process for manufacturing an optoelectronic module influences thelocation of the fluid-permeable channel within the module. Often,wafer-level manufacturing methods are employed to manufacture a wafer oftens, hundreds, or even thousands of contiguous optoelectronic modules.Subsequent manufacturing steps require separating (e.g., dicing) thewafer of contiguous optoelectronic modules into discrete modules. Theseparating process, however, can introduce foreign matter (e.g., dicingfluid, dicing particles) into the module via the fluid-permeablechannels. The foreign matter can detrimentally affect performance and,in some instances, can generate serious eye-safety concerns.

Consequently, the wafer of contiguous optoelectronic modules istypically mounted onto a separation substrate such as dicing tape viathe electronic substrate wherein the fluid-permeable channels have beenpreviously incorporated. The procedure effectively seals off thefluid-permeable channels for the subsequent separating steps therebypreventing foreign matter from entering into the optoelectronic modulesvia the fluid permeable channels.

Nevertheless, while incorporating the fluid-permeable channels into theelectronic substrate effectively keeps foreign matter out of the modulesduring the separating step, the location provides serious complicationsfor subsequent manufacturing steps. For example, electronic componentslocated adjacent to the fluid-permeable channels are mountedelectrically to the electronic substrate with solder and flux. Duringthis process, the electronic substrate (i.e., the substrate into whichthe fluid-permeable channels have been incorporated), solder, and fluxare heated (to melt the solder and flux), and then cooled. Upon coolinga vacuum can be generated within the optoelectronic module. Any fluxstill in a fluidic state can be drawn into an adjacent fluid-permeablechannel, wherein upon further cooling the solder flux can solidify andcan block the channel. Consequently, any heat generated by componentswithin the module during operation could accumulate, and could seriouslyaffect performance.

SUMMARY

This disclosure describes discrete optoelectronic modules and wafershaving pluralities of contiguous optoelectronic modules. Theoptoelectronic modules include fluid permeable channels, and areconfigured such that: 1) the channels are sealed to foreign matterduring certain manufacturing steps, such as steps involving theseparation of a plurality of contiguous modules into a plurality ofdiscrete, non-contiguous modules; 2) the channels remain free fromblockages, such as solidified flux, during certain manufacturing steps,such as steps involving electrically mounting components; 3) thechannels can permit heat (i.e., heated fluids) to escape from theoptoelectronic module during operation; 4) incorporated spacers canmitigate or eliminate cross-talk; 5) incorporated alignment componentscan permit the precise alignment of optical components and respectiveactive optoelectronic components; and/or 6) incorporated adhesivechannels can prevent adhesive from migrating onto optical components.

In a first aspect, for example, an optoelectronic module includes anactive optoelectronic component mounted electrically to an activeoptoelectronic component substrate, and a spacer laterally surroundingthe active optoelectronic component thereby forming a chamber. Thespacer includes an optical component mounting surface, a fluid permeablechannel, and a module mounting surface. The optoelectronic modulefurther includes an optical component mounted onto the optical componentmounting surface.

In another aspect, for example, an optoelectronic module includes afluid permeable channel. The channel can be adjacent to an opticalcomponent mounting surface.

In another aspect, for example, an optoelectronic module includes amodule mounting surface adjacent to an optical component mountingsurface.

In another aspect, for example, an optoelectronic module includes anactive optoelectronic component operable to emit a particular range ofwavelengths of electromagnetic radiation, and in some instance, caninclude an active optoelectronic component sensitive to a particularrange of wavelengths of electromagnetic radiation.

In another aspect, for example, an optoelectronic module includes aspacer that is substantially non-transmissive to a particular range ofwavelengths of electromagnetic radiation.

In another aspect, for example, an optoelectronic module includes anoptical component mounted to an optical mounting surface with adhesive.

In another aspect, for example, an optoelectronic module includes aspacer having an adhesive channel adjacent to an optical componentmounting surface.

In another aspect, for example, an optoelectronic module includes aspacer with an alignment component and an adhesive channel. Both thealignment component and the adhesive channel can be adjacent to anoptical component mounting surface.

In another aspect, for example, an optoelectronic module includes anoptical component having an adhesive channel and an alignment component.

In another aspect, for example, an optoelectronic module includes afluid permeable channel adjacent to an active optoelectronic component.The fluid permeable channel can include a fluid permeable membrane.

In another aspect, for example, an optoelectronic module includes amodule mounting surface. The module mounting surface can be operable toseal a chamber and a fluid-permeable channel when the module mountingsurface is in contact with an adhesive substrate.

In another aspect, for example, an optoelectronic module includes anactive optoelectronic component. The active optoelectronic component canbe a laser diode, a light-emitting diode, an array of laser diodes,and/or an array of light emitting diodes.

In another aspect, for example, an optoelectronic module includes anactive optoelectronic component. The active optoelectronic component canbe a photodiode, an array of photodiodes, and/or an array of pixels.

In another aspect, for example, an optoelectronic module includes aspacer. The spacer can be composed, at least in part, of a polymericmaterial.

In another aspect, for example, an optoelectronic module includes anactive optoelectronic component substrate. The active optoelectroniccomponent substrate can be composed, at least in part, of a lead frame.

In another aspect, for example, a method of manufacturing anoptoelectronic module from a plurality of optoelectronic modulesincludes the step of mounting electrically a plurality of activeoptoelectronic components to an active optoelectronic componentsubstrate. The active optoelectronic component substrate can belaterally surrounded by a spacer forming a chamber. The spacer caninclude an optical component mounting surface, a fluid permeablechannel, and a module mounting surface. The method of manufacturing canfurther include the steps of applying an adhesive to the opticalcomponent mounting surface, mounting an optical component to the opticalcomponent mounting surface, curing the adhesive, mounting theoptoelectronic module via the module mounting surface to an adhesivesubstrate, and separating the plurality of optoelectronic modules intosingulated optoelectronic modules.

In another aspect, for example, a method can include the step ofremoving an adhesive substrate from a plurality of optoelectronicmodules with thermal and/or electromagnetic radiation.

In another aspect, for example, a method can include the step ofmounting an optoelectronic module or a plurality of optoelectronicmodules into a host device.

In another aspect, for example, a method can include the step ofsubjecting an optoelectronic module or a plurality of optoelectronicmodules to a heat treatment.

In another aspect, for example, a method can include the step ofmounting an optoelectronic module or a plurality of optoelectronicmodules via a module mounting surface to an adhesive substrate, whereinthe adhesive substrate is a dicing tape.

Other aspects, features, and advantages will be apparent from thefollowing detailed description, the accompanying drawings, and theclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A depicts a schematic top view of an example optoelectronic modulehaving a fluid permeable channel.

FIG. 1B depicts a schematic side view of the example optoelectronicmodule depicted in FIG. 1A.

FIG. 1C depicts a magnified side view of the example optoelectronicmodule depicted in FIG. 1A.

FIG. 1D depicts a plan view of an example optoelectronic module withadhesive.

FIG. 1E depicts a side view of the example optoelectronic moduledepicted in FIG. 1D.

FIG. 1F depicts a magnified side view of the example optoelectronicmodule depicted in FIG. 1A.

FIG. 1G depicts a side view of an example of a plurality of contiguousoptoelectronic modules.

FIG. 1H depicts a side view of the plurality of optoelectronic modulesdepicted in FIG. 1G including singulation lines.

FIG. 2A depicts a schematic top view of another example optoelectronicmodule having a fluid permeable channel.

FIG. 2B depicts a schematic side view of the example optoelectronicmodule depicted in FIG. 2A.

FIG. 3A depicts a schematic top view of an optoelectronic module havinga fluid permeable channel and an adhesive channel.

FIG. 3B depicts a schematic side view of the example optoelectronicmodule depicted in FIG. 3A.

FIG. 3C depicts a magnified side view of the example optoelectronicmodule depicted in FIG. 3A.

FIG. 3D depicts a magnified side view of the example optoelectronicmodule depicted in FIG. 3A with adhesive.

FIG. 4A depicts a schematic top view of an example optoelectronic modulehaving a fluid permeable channel, an adhesive channel, and an alignmentcomponent.

FIG. 4B depicts a schematic side view of the example optoelectronicmodule depicted in FIG. 4A.

FIG. 4C depicts a magnified side view of the example optoelectronicmodule depicted in FIG. 4A.

FIG. 4D depicts a magnified side view of the example optoelectronicmodule depicted in FIG. 4A and an example location of adhesive.

FIG. 5A depicts a schematic top view of yet another exampleoptoelectronic module having a fluid permeable channel.

FIG. 5B depicts a schematic side view of the example optoelectronicmodule depicted in FIG. 5A.

FIG. 5C depicts a magnified side view of the example optoelectronicmodule depicted in FIG. 5A.

FIG. 6A depicts a schematic top view of another example optoelectronicmodule having a fluid permeable channel, an adhesive channel, and analignment component.

FIG. 6B depicts a schematic side view of the example optoelectronicmodule depicted in FIG. 6A.

FIG. 6C depicts a magnified side view of the example optoelectronicmodule depicted in FIG. 6A.

FIG. 6D depicts a magnified side view of the example optoelectronicmodule depicted in FIG. 6A and an example location of adhesive.

FIG. 7 depicts a process of manufacturing an example optoelectronicmodule from a plurality of optoelectronic modules.

FIG. 8 depicts another process of manufacturing an exampleoptoelectronic module from a plurality of optoelectronic modules.

DETAILED DESCRIPTION

FIG. 1A depicts a schematic top view of an example optoelectronic module100 having a fluid permeable channel. The optoelectronic module 100 caninclude an active optoelectronic component 102 mounted electrically toan active optoelectronic component substrate 104 (e.g., a printedcircuit board PCB or a metallic component such as a lead frame). Theactive optoelectronic component 102 can include light emitting (e.g.,light-emitting diodes, laser diodes, and/or arrays of light-emittingdiodes or laser diodes) and/or light detecting components (e.g.,photodiodes, arrays of photodiodes, charge-couple device-based imagesensors and/or complementary metal-oxide semiconductor-based imagesensors).

The optoelectronic module 100 can further include a spacer 106. Thespacer 106 can laterally surround the active optoelectronic component102 thereby forming a chamber 108. In some implementations, the spacer106 can be formed around the active optoelectronic component substrate104. For example, a plurality of spacers 106 can be formed around a leadframe, the lead frame being a plurality of active optoelectroniccomponent substrates 104. The spacer can be composed of a polymericmaterial such as an epoxy resin. The spacer 106 can be operable tosubstantially attenuate wavelengths of electromagnetic radiation. Forexample, the spacer 106 can be substantially non-transparent towavelengths of light emitted by and/or detectable by the activeoptoelectronic component 102. The spacer 106 can be formed from amoldable material. For example, in some implementations the spacer 106can be formed via injection molding and/or vacuum assisted molding insome implementations. In some implementations, the spacer 106 can beformed from a molding resin. In some implementations, the spacer 106 canfurther be composed of non-transparent organic and/or inorganic fillerssuch as carbon black.

The optoelectronic module 100 can further include an optical component110 mounted to the spacer 106 via an optical component mounting surface112. In some implementations, the optical component 110 can include arefractive lens, a diffractive lens, and/or an array of refractiveand/or diffractive lenses. In some implementations, the opticalcomponent 110 can include a spectral filter. In some implementations,the optical component 110 can include a transparent cover. In someimplementations, the optical component 110 can be mounted to the opticalcomponent mounting surface 112 at an operable distance from the activeoptoelectronic component 102.

The optoelectronic module 100 can further include a fluid-permeablechannel 114 formed within the spacer 106. In some implementations, thefluid-permeable channel 114 is operable to permit the outflow of fluidsfrom the chamber 108. The fluid-permeable channel 114 can be formedwithin the spacer 106 adjacent to the optical component 110.

The optoelectronic module 100 can further include a module mountingsurface 116 formed on the spacer 106. The module mounting surface 116 isconfigured to permit the optoelectronic module 100 to be temporarilysealed during manufacturing of the optoelectronic module 100. In someimplementations, for example, the module mounting surface 116 ischaracterized by a flat surface wherein the fluid-permeable channel 114does not extend such that a seal can be established via a temporarysubstrate (e.g., dicing tape).

The optoelectronic module 100 can further include an optical componentoffset 118 as depicted in the schematic side view of FIG. 1B and themagnified side of FIG. 1C. In some implementations, the opticalcomponent offset 118 can prevent the optical component 110 from adheringto a temporary substrate, such as a dicing tape, while still allowingthe optoelectronic module 100 to be securely fixed to the temporarysubstrate.

FIG. 1D depicts a plan view of the optoelectronic module 100 withadhesive 122. Further, FIG. 1E depicts a side view of the exampleoptoelectronic module 100 with adhesive, and FIG. 1F depicts a magnifiedside view of the example optoelectronic module depicted in FIG. 1A. Theadhesive 122 is depicted in an example location. In some instance, moreor less adhesive, corresponding to more or less coverage may berequired. The adhesive 122 can be located on the optical componentmounting surface 112. In some implementations, the adhesive 122 can belocated in between the optical component mounting surface 112 and theoptical component 110. The adhesive 122 is operable to fix the opticalcomponent 110 to the optical component mounting surface 112. In someimplementations, the adhesive 122 can be mounted to the opticalcomponent mounting surface 112 by jetting and/or screen printing. Insome implementations, the adhesive 122 can be a curable adhesive such asepoxy. For, example the adhesive 122 can be mounted to the opticalcomponent mounting surface 112 in a substantially fluidic state and canbe cured with electromagnetic radiation, such as ultraviolet lightand/or infrared light.

FIG. 1G depicts a side view of a contiguous plurality of optoelectronicmodules. The optoelectronic module 100 can be manufactured from anoptoelectronic module plurality 120. The optoelectronic module plurality120 can be mounted to an adhesive substrate 124 via the module mountingsurface 116. The optoelectronic module plurality 120 can include a largenumber of optoelectronic modules. For example, optoelectronic moduleplurality 120 can include tens, hundreds, or even thousands ofoptoelectronic modules. The optoelectronic module plurality 120 can be awafer. In some implementations, the adhesive substrate 124 can be anadhesive tape such as dicing tape. In some implementations, the adhesivesubstrate 124 can be thermally deactivated adhesive tape or can bedeactivated with electromagnetic radiation, such as ultraviolet light orinfrared light.

FIG. 1H depicts a side view of a contiguous plurality of optoelectronicmodules with schematic singulation lines. The optoelectronic moduleplurality 120 can be separated into discrete optoelectronic modules(e.g., optoelectronic module 100) along singulation lines 126. In someimplementations, the optoelectronic module plurality 120 can beseparated by mechanical dicing. In some implementations, a fluid can beused when mechanically dicing the optoelectronic module plurality 120.In some implementations, the optoelectronic module plurality 120 can beseparated by a laser beam. The module mounting surface 116 and theadhesive substrate 124 can form a barrier against the fluid. In otherimplementations, the module mounting surface 116 and the adhesivesubstrate 124 can form a barrier against particles created during themechanical separation of optoelectronic module plurality 120 intodiscrete optoelectronic modules 100.

FIG. 2A depicts a schematic top view of another example optoelectronicmodule 200 having a fluid permeable channel. The optoelectronic module200 can include an active optoelectronic component 202 mountedelectrically to an active optoelectronic component substrate 204 (e.g.,a printed circuit board PCB or a metallic component such as a leadframe). The active optoelectronic component 202 can include lightemitting (e.g., light-emitting diodes, laser diodes, and/or arrays oflight-emitting diodes or laser diodes) and/or light detecting components(e.g., photodiodes, arrays of photodiodes, charge-couple device-basedimage sensors and/or complementary metal-oxide semiconductor-based imagesensors).

The optoelectronic module 200 can further include a spacer 206. Thespacer 206 can laterally surround the active optoelectronic component202 thereby forming a chamber 208. In some implementations, the spacer206 can be formed around the active optoelectronic component substrate204. For example, a plurality of spacers 206 can be formed around a leadframe, the lead frame being a plurality of active optoelectroniccomponent substrates 204. The spacer can be composed of a polymericmaterial such as an epoxy resin. The spacer 206 can be operable tosubstantially attenuate wavelengths of electromagnetic radiation. Forexample, the spacer 206 can be substantially non-transparent towavelengths of light emitted by and/or detectable by the activeoptoelectronic component 202. The spacer 206 can be formed from amoldable material. For example, in some implementations the spacer 206can be formed via injection molding and/or vacuum assisted molding insome implementations. In some implementations, the spacer 206 can beformed from a molding resin. In some implementations, the spacer 206 canfurther be composed of non-transparent organic and/or inorganic fillerssuch as carbon black.

The optoelectronic module 200 can further include an optical component210 mounted to the spacer 206 via an optical component mounting surface212. In some implementations, the optical component 210 can include arefractive lens, a diffractive lens, and/or an array of refractiveand/or diffractive lenses. In some implementations, the opticalcomponent 210 can include a spectral filter. In some implementations,the optical component 210 can include a transparent cover. In someimplementations, the optical component 210 can be mounted to the opticalcomponent mounting surface 212 at an operable distance from the activeoptoelectronic component 202.

The optoelectronic module 200 can further include a fluid-permeablechannel 214 formed within the spacer 206. In some implementations, thefluid-permeable channel 214 is operable to permit the outflow of fluidsfrom the chamber 208. The fluid-permeable channel 214 can be formedwithin the spacer 206 adjacent to the optical component 210.

The optoelectronic module 200 further includes a module mounting surface216 formed on the spacer 206. The module mounting surface 216 isconfigured to permit the optoelectronic module 200 to be temporarilysealed during manufacturing of the optoelectronic module 200. In someimplementations, for example, the module mounting surface 216 ischaracterized by a flat surface wherein the fluid-permeable channel 214does not extend such that a seal can be established via a temporarysubstrate (e.g., dicing tape).

The optoelectronic module 200 can further includes a fluid-permeablechannel 214. The fluid-permeable channel 214 can extend into the modulemounting surface 216 as depicted in FIG. 2A and FIG. 2B. FIG. 2B depictsa schematic side view of the optoelectronic module depicted in FIG. 2A.The fluid-permeable channel 214 extends into the module mounting surface216. The fluid-permeable channel 214 depicted in FIG. 2A and FIG. 2B canhave an advantage in some implementations. For example, adhesive used tomount the optical component 210 to the optical component mountingsurface 212 can partially obstruct part of the fluid-permeable channel214. The fluid-permeable channel 214 extension into the module mountingsurface 216 (via the spacer 206) can permit outflow of fluids despitethe partial incursion of adhesive into the fluid-permeable channel 214.

FIG. 3A depicts a schematic top view of an example optoelectronic module300 having a fluid permeable channel and an adhesive channel. Theoptoelectronic module 300 can include an active optoelectronic component302 mounted electrically to an active optoelectronic component substrate304 (e.g., a printed circuit board PCB or a metallic component such as alead frame). The active optoelectronic component 302 can include lightemitting (e.g., light-emitting diodes, laser diodes, and/or arrays oflight-emitting diodes or laser diodes) and/or light detecting components(e.g., photodiodes, arrays of photodiodes, charge-couple device-basedimage sensors and/or complementary metal-oxide semiconductor-based imagesensors).

The optoelectronic module 300 can further include a spacer 306. Thespacer 306 can laterally surround the active optoelectronic component302 thereby forming a chamber 308. In some implementations, the spacer306 can be formed around the active optoelectronic component substrate304. For example, a plurality of spacers 306 can be formed around a leadframe, the lead frame being a plurality of active optoelectroniccomponent substrates 304. The spacer can be composed of a polymericmaterial such as an epoxy resin. The spacer 306 can be operable tosubstantially attenuate wavelengths of electromagnetic radiation. Forexample, the spacer 306 can be substantially non-transparent towavelengths of light emitted by and/or detectable by the activeoptoelectronic component 302. The spacer 306 can be formed from amoldable material. For example, in some implementations the spacer 306can be formed via injection molding and/or vacuum assisted molding insome implementations. In some implementations, the spacer 306 can beformed from a molding resin. In some implementations, the spacer 306 canfurther be composed of non-transparent organic and/or inorganic fillerssuch as carbon black.

The optoelectronic module 300 can further include an optical component310 mounted to the spacer 306 via an optical component mounting surface312. In some implementations, the optical component 310 can include arefractive lens, a diffractive lens, and/or an array of refractiveand/or diffractive lenses. In some implementations, the opticalcomponent 310 can include a spectral filter. In some implementations,the optical component 310 can include a transparent cover. In someimplementations, the optical component 310 can be mounted to the opticalcomponent mounting surface 312 at an operable distance from the activeoptoelectronic component 302.

The optoelectronic module 300 can further include a fluid-permeablechannel 314 formed within the spacer 306. In some implementations, thefluid-permeable channel 314 is operable to permit the outflow of fluidsfrom the chamber 308. The fluid-permeable channel 314 can be formedwithin the spacer 306 adjacent to the optical component 310.

The optoelectronic module 300 further includes a module mounting surface316 formed on the spacer 306. The module mounting surface 316 isconfigured to permit the optoelectronic module 300 to be temporarilysealed during manufacturing of the optoelectronic module 300. In someimplementations, for example, the module mounting surface 316 ischaracterized by a flat surface wherein the fluid-permeable channel 314does not extend such that a seal can be established via a temporarysubstrate (e.g., dicing tape).

The optoelectronic module 300 further includes an adhesive channel 321.The adhesive channel 321 can be filled with adhesive 322 such thatoptical component 310 is mounted to the optical component mountingsurface 312 via the adhesive 322. In some implementations, the adhesivechannel 321 can lead to less tolerance in the mounting of the opticalcomponent 310 with respect to the active optoelectronic component 302.

FIG. 3B depicts a schematic side view of the optoelectronic moduledepicted in FIG. 3A. FIG. 3C depicts a magnified side view of theoptoelectronic module depicted in FIG. 3A. FIG. 3D depicts a magnifiedside view of the optoelectronic module depicted in FIG. 3A and anexample location of adhesive 322.

FIG. 4A depicts a schematic top view of an example optoelectronic module400 having a fluid permeable channel, an adhesive channel, and analignment component. The optoelectronic module 400 can include an activeoptoelectronic component 402 mounted electrically to an activeoptoelectronic component substrate 404 (e.g., a printed circuit boardPCB or a metallic component such as a lead frame). The activeoptoelectronic component 402 can include light emitting (e.g.,light-emitting diodes, laser diodes, and/or arrays of light-emittingdiodes or laser diodes) and/or light detecting components (e.g.,photodiodes, arrays of photodiodes, charge-couple device-based imagesensors and/or complementary metal-oxide semiconductor-based imagesensors).

The optoelectronic module 400 can further include a spacer 406. Thespacer 406 can laterally surround the active optoelectronic component402 thereby forming a chamber 408. In some implementations, the spacer406 can be formed around the active optoelectronic component substrate404. For example, a plurality of spacers 406 can be formed around a leadframe, the lead frame being a plurality of active optoelectroniccomponent substrates 404. The spacer can be composed of a polymericmaterial such as an epoxy resin. The spacer 406 can be operable tosubstantially attenuate wavelengths of electromagnetic radiation. Forexample, the spacer 406 can be substantially non-transparent towavelengths of light emitted by and/or detectable by the activeoptoelectronic component 402. The spacer 406 can be formed from amoldable material. For example, in some implementations the spacer 406can be formed via injection molding and/or vacuum assisted molding insome implementations. In some implementations, the spacer 406 can beformed from a molding resin. In some implementations, the spacer 406 canfurther be composed of non-transparent organic and/or inorganic fillerssuch as carbon black.

The optoelectronic module 400 can further include an optical component410 mounted to the spacer 406 via an optical component mounting surface412. In some implementations, the optical component 410 can include arefractive lens, a diffractive lens, and/or an array of refractiveand/or diffractive lenses. In some implementations, the opticalcomponent 410 can include a spectral filter. In some implementations,the optical component 410 can include a transparent cover. In someimplementations, the optical component 410 can be mounted to the opticalcomponent mounting surface 412 at an operable distance from the activeoptoelectronic component 402.

The optoelectronic module 400 can further include an alignment component413 and an adhesive channel 421. The alignment component 413 can be anextension of the spacer 406, the alignment component 413 terminating inthe optical component mounting surface 412. The adhesive channel 421 canbe filled with adhesive 422 such that optical component 410 is mountedto the optical component mounting surface 412 via the adhesive 422. Insome implementations, the adhesive channel 421 can lead to lesstolerance in the mounting of the optical component 410 with respect tothe active optoelectronic component 402. In some implementations, thealignment component 413 and the adhesive channel 421 can lead to lesstolerance in the mounting of the optical component 410 with respect tothe active optoelectronic components active optoelectronic component402. For example, in some cases the alignment component 413 can beadjusted (e.g., via mechanically machining, or via laser) so that theoptical component 410 can be mounted with respect to the activeoptoelectronic component 402. Accordingly, in some cases the alignmentcomponent 413 can be configured to correct for tilt. In someimplementations, the optical component 410 is directly mounted to theoptical component mounting surface 412 via the alignment component 413.FIG. 4B depicts a schematic side view of the optoelectronic moduledepicted in FIG. 4A. FIG. 4C depicts a magnified side view of theoptoelectronic module depicted in FIG. 4A. FIG. 4D depicts a magnifiedside view of the optoelectronic module depicted in FIG. 4A and anexample location of adhesive.

FIG. 5A depicts a schematic top view of another optoelectronic module500 having a fluid permeable channel. The optoelectronic module 500 caninclude an active optoelectronic component 502 mounted electrically toan active optoelectronic component substrate 504 (e.g., a printedcircuit board PCB or a metallic component such as a lead frame). Theactive optoelectronic component 502 can include light emitting (e.g.,light-emitting diodes, laser diodes, and/or arrays of light-emittingdiodes or laser diodes) and/or light detecting components (e.g.,photodiodes, arrays of photodiodes, charge-couple device-based imagesensors and/or complementary metal-oxide semiconductor-based imagesensors).

The optoelectronic module 500 can further include a spacer 506. Thespacer 506 can laterally surround the active optoelectronic component502 thereby forming a chamber 508. In some implementations, the spacer506 can be formed around the active optoelectronic component substrate504. For example, a plurality of spacers 506 can be formed around a leadframe, the lead frame being a plurality of active optoelectroniccomponent substrates 504. The spacer can be composed of a polymericmaterial such as an epoxy resin. The spacer 506 can be operable tosubstantially attenuate wavelengths of electromagnetic radiation. Forexample, the spacer 506 can be substantially non-transparent towavelengths of light emitted by and/or detectable by the activeoptoelectronic component 502. The spacer 506 can be formed from amoldable material. For example, in some implementations the spacer 506can be formed via injection molding and/or vacuum assisted molding insome implementations. In some implementations, the spacer 506 can beformed from a molding resin. In some implementations, the spacer 506 canfurther be composed of non-transparent organic and/or inorganic fillerssuch as carbon black.

The optoelectronic module 500 can further include an optical component510 mounted to the spacer 506 via an optical component mounting surface512. In some implementations, the optical component 510 can include arefractive lens, a diffractive lens, and/or an array of refractiveand/or diffractive lenses. In some implementations, the opticalcomponent 510 can include a spectral filter. In some implementations,the optical component 510 can include a transparent cover. In someimplementations, the optical component 510 can be mounted to the opticalcomponent mounting surface 512 at an operable distance from the activeoptoelectronic component 502. The optoelectronic module 500 can furtherinclude a fluid-permeable channel 514 formed within the spacer 506. Thefluid-permeable channel 514 includes a fluid-permeable membrane 528(e.g., GORE-TEX®). The fluid-permeable membrane 528 can be fixed on orin the fluid-permeable channel 514. In some implementations, thefluid-permeable channel 514 is operable to permit the outflow of fluidsfrom the chamber 508. The fluid-permeable channel 514 can be formedwithin the active optoelectronic component substrates 504 adjacent tothe active optoelectronic component 502. In some implementations, theoptoelectronic module 500 can further include a module mounting surface516 formed on the spacer 506. The module mounting surface 516 isconfigured to permit the optoelectronic module 500 to be temporarilysealed during manufacturing of the optoelectronic module 500. In someimplementations, for example, the module mounting surface 516 ischaracterized by a flat surface such that a seal can be established viaa temporary substrate (e.g., dicing tape). In some implementations, forexample, the optoelectronic module 500 need not include a modulemounting surface 516, the module can be mounted via the activeoptoelectronic mounting surface 512.

FIG. 5B depicts a schematic side view of the optoelectronic moduledepicted in FIG. 5A. and FIG. 5C depicts a magnified side view of theoptoelectronic module depicted in FIG. 5A.

FIG. 6A depicts a schematic top view of an optoelectronic module 600having a fluid permeable channel and an adhesive channel. Theoptoelectronic module 600 can include an active optoelectronic component602 mounted electrically to an active optoelectronic component substrate604 (e.g., a printed circuit board PCB or a metallic component such as alead frame). The active optoelectronic component 602 can include lightemitting (e.g., light-emitting diodes, laser diodes, and/or arrays oflight-emitting diodes or laser diodes) and/or light detecting components(e.g., photodiodes, arrays of photodiodes, charge-couple device-basedimage sensors and/or complementary metal-oxide semiconductor-based imagesensors).

The optoelectronic module 600 can further include a spacer 606. Thespacer 606 can laterally surround the active optoelectronic component602 thereby forming a chamber 608. In some implementations, the spacer606 can be formed around the active optoelectronic component substrate604. For example, a plurality of spacers 606 can be formed around a leadframe, the lead frame being a plurality of active optoelectroniccomponent substrates 604. The spacer can be composed of a polymericmaterial such as an epoxy resin. The spacer 606 can be operable tosubstantially attenuate wavelengths of electromagnetic radiation. Forexample, the spacer 606 can be substantially non-transparent towavelengths of light emitted by and/or detectable by the activeoptoelectronic component 602. The spacer 606 can be formed from amoldable material. For example, in some implementations the spacer 606can be formed via injection molding and/or vacuum assisted molding insome implementations. In some implementations, the spacer 606 can beformed from a molding resin. In some implementations, the spacer 606 canfurther be composed of non-transparent organic and/or inorganic fillerssuch as carbon black.

The optoelectronic module 600 can further include an optical component610 mounted to the spacer 606 via an optical component mounting surface612. In some implementations, the optical component 610 can include arefractive lens, a diffractive lens, and/or an array of refractiveand/or diffractive lenses. In some implementations, the opticalcomponent 610 can include a spectral filter. In some implementations,the optical component 610 can include a transparent cover. In someimplementations, the optical component 610 can be mounted to the opticalcomponent mounting surface 612 at an operable distance from the activeoptoelectronic component 602.

The optoelectronic module 600 can further include a fluid-permeablechannel 614 formed within the spacer 606. In some implementations, thefluid-permeable channel 614 is operable to permit the outflow of fluidsfrom the chamber 608. The fluid-permeable channel 614 can be formedwithin the spacer 606 adjacent to the optical component 610. Theoptoelectronic module 600 further includes a module mounting surface 616formed on the spacer 606. The module mounting surface 616 is configuredto permit the optoelectronic module 600 to be temporarily sealed duringmanufacturing of the optoelectronic module 600. In some implementations,for example, the module mounting surface 616 is characterized by a flatsurface wherein the fluid-permeable channel 614 does not extend suchthat a seal can be established via a temporary substrate (e.g., dicingtape). The optoelectronic module 600 further includes an adhesivechannel 621 and an alignment component 613 formed within the opticalcomponent 610. In some implementations, the alignment component 613 andthe adhesive channel 621 can lead to less tolerance in the mounting ofthe optical component 610 with respect to the active optoelectroniccomponent 602. For example, in some cases the alignment component 613can be adjusted (e.g., via mechanically machining, or via laser) so thatthe optical component 610 can be mounted with respect to the activeoptoelectronic component 602.

FIG. 6B depicts a schematic side view of the optoelectronic moduledepicted in FIG. 6A, FIG. 6C depicts a magnified side view of theoptoelectronic module depicted in FIG. 6A, and FIG. 6D depicts amagnified side view of the optoelectronic module depicted in FIG. 6A andan example location of adhesive.

FIG. 7 depicts a process 700 of manufacturing an optoelectronic modulefrom a plurality of optoelectronic modules. The process 700 ofmanufacturing an optoelectronic module from a plurality ofoptoelectronic modules includes an electrically mounting step 702wherein a plurality of active optoelectronic components is mountedelectrically to a plurality of active optoelectronic componentsubstrates. The active optoelectronic component substrates can belaterally surrounded by a plurality of spacers. The spacers can form aplurality of respective chambers, and can further include a plurality ofrespective optical component mounting surfaces. The spacer can furtherinclude a plurality of respective fluid permeable channels, and aplurality of respective module mounting surfaces.

The process 700 of manufacturing an optoelectronic module from aplurality of optoelectronic modules can further include an adhesiveapplication step 704 wherein an adhesive is applied to the plurality ofoptical component mounting surfaces.

The process 700 of manufacturing an optoelectronic module from aplurality of optoelectronic modules can further include an opticalcomponent mounting step 706 wherein a plurality of optical components ismounted to a plurality of respective optical component mountingsurfaces.

The process 700 of manufacturing an optoelectronic module from aplurality of optoelectronic modules can further include an adhesivecuring step 708 wherein adhesive is cured (e.g., via the application ofheat and/or electromagnetic radiation such as ultraviolet light).

The process 700 of manufacturing an optoelectronic module from aplurality of optoelectronic modules can further include anoptoelectronic module mounting step 710 wherein a plurality ofoptoelectronic modules is mounted to an adhesive substrate (e.g., adicing tape) via a plurality of module mounting surfaces.

The process 700 of manufacturing an optoelectronic module from aplurality of optoelectronic modules can further include a moduleseparation step 712 wherein the plurality of optoelectronic modules isseparated into discrete optoelectronic modules (e.g., via dicing).

FIG. 8 depicts a process 800 of manufacturing an optoelectronic modulefrom a plurality of optoelectronic modules. The process 800 ofmanufacturing an optoelectronic module from a plurality ofoptoelectronic modules 800 includes an electrically mounting step 802wherein a plurality of active optoelectronic components is mountedelectrically to a plurality of active optoelectronic componentsubstrates. The active optoelectronic component substrates can belaterally surrounded by a plurality of spacers. The spacers can form aplurality of respective chambers, and can further include a plurality ofrespective optical component mounting surfaces. The spacer can furtherinclude a plurality of respective fluid permeable channels, and aplurality of respective module mounting surfaces.

The process 800 of manufacturing an optoelectronic module from aplurality of optoelectronic modules can further include an adhesiveapplication step 804 wherein an adhesive is applied to the plurality ofoptical component mounting surfaces, and an optical component mountingstep 806 wherein a plurality of optical components is mounted to aplurality of respective optical component mounting surfaces.

The process 800 of manufacturing an optoelectronic module from aplurality of optoelectronic modules can further include an adhesivecuring step 808 wherein adhesive is cured (e.g., via the application ofheat and/or electromagnetic radiation such as ultraviolet light).

The process 800 of manufacturing an optoelectronic module from aplurality of optoelectronic modules can further include anoptoelectronic module mounting step 810 wherein a plurality ofoptoelectronic modules is mounted to an adhesive substrate (e.g., adicing tape) via a plurality of module mounting surfaces.

The process 800 of manufacturing an optoelectronic module from aplurality of optoelectronic modules can further include a moduleseparation step 812 wherein the plurality of optoelectronic modules isseparated into discrete optoelectronic modules (e.g., via dicing).

The process 800 of manufacturing an optoelectronic module from aplurality of optoelectronic modules can further include a host devicemounting step 814 wherein a discrete optoelectronic module is mountedonto a circuit board (e.g., to be mounted into a host device), a heattreatment step 816 wherein the optoelectronic module is subject to aheat treatment followed by cooling in order to electrically connect theoptoelectronic module to the circuit board (e.g., via the melting andcooling of solder and solder flux).

Other modifications may be made to the foregoing implementations, andfeatures described above in different implementations may be combined inthe same implementation. Thus, other implementations are within thescope of the claims.

1. An optoelectronic module comprising: an active optoelectroniccomponent mounted electrically to an active optoelectronic componentsubstrate; a spacer laterally surrounding the active optoelectroniccomponent forming a chamber, wherein the spacer includes an opticalcomponent mounting surface, a fluid permeable channel, and a modulemounting surface; and an optical component mounted onto the opticalcomponent mounting surface.
 2. The optoelectronic module of claim 1, thefluid permeable channel being adjacent to the optical component mountingsurface.
 3. The optoelectronic module of claim 1, the module mountingsurface being adjacent to the optical component mounting surface.
 4. Theoptoelectronic module of claim 1, the active optoelectronic componentbeing operable to emit a particular range of wavelengths and/or beingsensitive to a particular range of wavelengths.
 5. The optoelectronicmodule of claim 4, wherein the spacer is substantially non-transmissiveto the particular range of wavelengths.
 6. The optoelectronic module ofclaim 1, wherein the optical component is mounted to the opticalcomponent mounting surface with adhesive.
 7. The optoelectronic moduleof claim 1, wherein the spacer further includes an adhesive channeladjacent to the optical component mounting surface.
 8. Theoptoelectronic module of claim 1, wherein the spacer further includes analignment component and adhesive channel adjacent to the opticalcomponent mounting surface.
 9. The optoelectronic module of claim 1,wherein the optical component includes an adhesive channel and analignment component.
 10. The optoelectronic module of claim 1, the fluidpermeable channel being adjacent to the active optoelectronic component,the fluid permeable channel being disposed with a fluid permeablemembrane.
 11. The optoelectronic module of claim 1, the module mountingsurface being operable to seal the chamber and fluid permeable channelwhen in contact with an adhesive substrate.
 12. The optoelectronicmodule of claim 1, the active optoelectronic component being a laserdiode, a light-emitting diode, an array of laser diodes, and/or an arrayof light emitting diodes.
 13. The optoelectronic module of claim 1, theactive optoelectronic component being a photodiode, an array ofphotodiodes, and/or an array of pixels.
 14. The optoelectronic module ofclaim 1, the spacer being composed of a polymeric material.
 15. Theoptoelectronic module of claim 1, the active optoelectronic componentsubstrate being composed of a lead frame.
 16. A method of manufacturingan optoelectronic module from a plurality of optoelectronicmodules, themethod comprising the steps of: electrically mounting a plurality ofactive optoelectronic components to an active optoelectronic componentsubstrate, the active optoelectronic component substrate being laterallysurrounded by a spacer forming a chamber, the spacer including anoptical component mounting surface, a fluid permeable channel, andmodule mounting surface; applying an adhesive to the optical componentmounting surface; mounting an optical component to the optical componentmounting surface; curing the adhesive; mounting the optoelectronicmodule via the module mounting surface to an adhesive substrate;separating the plurality of optoelectronic modules into singulatedoptoelectronic modules.
 17. The method of claim 16 further comprisingthe step of removing the adhesive substrate from the plurality ofoptoelectronic modules with thermal and/or electromagnetic radiation.18. The method of claim 16 further comprising the step of mounting theoptoelectronic module into a host device.
 19. The method of claim 18further comprising the step of subjecting the optoelectronic module to aheat treatment.
 20. The method of claim 16 wherein the adhesivesubstrate is a dicing tape.